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SHAOXING HUALI ELECTRONICS CO., LTD.
Home> Products> IC Lead Frame> Metal Etching C192 Lead Frame for Semiconductor Packaging
Metal Etching C192 Lead Frame for Semiconductor Packaging
Metal Etching C192 Lead Frame for Semiconductor Packaging
Metal Etching C192 Lead Frame for Semiconductor Packaging

Metal Etching C192 Lead Frame for Semiconductor Packaging

Payment Type:T/T

Incoterm:FOB,CIF,EXW

Min. Order:200 Piece/Pieces

Transportation:Ocean,Air,Express

Port:NINGBO,SHANGHAI

Product Description
Product Attributes

Place Of OriginChina

MaterialAlloy

Supply Ability & Additional Information

TransportationOcean,Air,Express

Place of OriginCHINA

CertificateISO9001:2015 / ISO14001:2015

HS Code8542900000

PortNINGBO,SHANGHAI

Payment TypeT/T

IncotermFOB,CIF,EXW

Packaging & Delivery
Selling Units:
Piece/Pieces
Chemical Etching IC Lead Frame for Semiconductor


Metal Etching C192 Lead Frame for Semiconductor Packaging


IC Lead Frame is the basic material for semiconductor packaging, so it is widely used in emerging products such as artificial intelligence, Internet of Things, smart manufacturing and new energy vehicles. The material we use in IC Lead Frame is C192 or C194 Copper. The production of lead frames by metal etching process can achieve higher precision, for example, we can produce multi-pin (more than 100 pins) products of Smooth IC Lead Frame, and can also produce ultra-thin products, such as etched 0.125mm thickness products. Moreover, we can guarantee that our etched Copper IC Lead Frame have uniform arrangement, straight etching line and also the half etching product's surface is smooth and delicate.


Below are the specific parameters of this product, please check more IC lead frame in our website for more ideas.

Material Thickness Minimum Diameter Minimum Distance Accuracy

C192/C194 Copper

0.125mm - 0.25 mm 0.05 mm 0.18 mm - 0.3 mm


+- 0.02 mm —— +- 0.04 mm




ETCH LEAD FRAME

Lead Frame 1 Jpg

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