Semiconductor Chip Carrier
DBC Substrate
Semiconductor Chip Carrier can be divided into thermo-electric modules, and the power electronic substrates.
Thermo-electric modules are plate-like semiconductor cooling devices that work by using the movement of heat when a current flows through the junction of two different metals. Compact, lightweight, and Freon-free, they are used in climate control seats of automobiles, cooling chillers, optical communications, biotechnology, air conditionners, dryers and a variety of consumer electronic products.
Application of Thermo-electric module Manufacturing Technology for Heat Dissipation and Insulation Substrate
Generally, organic and metal substrates are used in the circuit boards of low-power home appliances and computers.
However, alumina, aluminum nitride and silicon nitride substrates are used in heat radiation insulated substrates of power modules that handle high power.
In particular, silicon nitride substrates are attracting attention for use in power modules of inverters and converters because of the increase in sales of HEVs and EVs.
