Payment Type:T/T
Incoterm:CIF,FOB,EXW
Min. Order:50 Piece/Pieces
Transportation:Ocean,Air,Express
Port:SHANGHAI,NINGBO
$0.2-10 /Piece/Pieces
Model No.: Customize
Brand: NO
Place Of Origin: China
Packaging: Can be based on customer request
Transportation: Ocean,Air,Express
Place of Origin: CHINA
Certificate: ISO9001:2015 / ISO14001:2015
HS Code: 8534009000
Port: SHANGHAI,NINGBO
Payment Type: T/T
Incoterm: CIF,FOB,EXW
Power Semiconductor Device Packaging Substrate
We are the best supplier and manufacturer of Flexible Substrate in China, we can customize the Double-Sided Etching with different graphics according to the customer's drawings. We are equipped with professional metal etching equipment and exposure development equipment. Our etching process can achieve neat alignment, no peeling, no incompleteness, no air holes, no inclusions and other appearance defects. Usually, the material for Etching Flexible Substrate is PE based double-sided copper cladding. It is mainly used in high-end car seats, car cold cup, car refrigerator, head display, car power and other fields.
Below are the specific parameters of this product, please check more Semiconductor Chip Carrier in our website for more ideas.
| MATERIAL | PE Base Double-sided Copper Clad |
| COPPER CLADDING THICKNESS | 0.3mm |
| PRODUCT FEATURES | Customizable double-sided etching with different graphics according to design Neatly Arranged, No Peeling, No Incomplete, No Air Holes, No Inclusions and Other Appearance Defects |
| TECHNICAL CAPABILITY | Minimum Pitch 0.5mm Manufacturing Capability Side Etching 0mm - 0.1mm |
| SURFACE TREATMENT | Anti-Oxidation, Silver Plating, Nickel Plating, Gold Plating |
CERAMIC SUBSTRATE PIC
SHAOXING HUALI ELECTRONICS CO., LTD. is the earliest precision machining manufacturer in China and is also a national high-tech etching enterprise specialized in producing metal etching products. Since its establishment in 1994, the company specializes in the production of integrated circuit lead frames and power semiconductor packaging ceramic substrates. The company excels in multiple processes such as metal etching, glass etching, precision stamping, electroplating, precision mold making, and precision injection molding, earning it a reputation as an industry leader. These exceptional manufacturing processes have not only made products applicable to various fields including display, communication, electronics, optics, machinery, automotive, medical, AI intelligence, and consumer electronics but have also gained significant market acclaim.
Currently, the company's primary product lineup includes VCM-SPRING camera modules for mobile phones, mobile phone accessories, automotive parts, metal filter screens, encoder gratings, precision masks, and various precision microelectronic components. These products showcase the company's exceptional capabilities in precision manufacturing and have earned widespread market recognition.
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