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SHAOXING HUALI ELECTRONICS CO., LTD.
Home> Products> Semiconductor Chip Carrier> Flexible Substrate> High Temperature Stability Flexible Substrate for Car Seat
High Temperature Stability Flexible Substrate for Car Seat
High Temperature Stability Flexible Substrate for Car Seat
High Temperature Stability Flexible Substrate for Car Seat

High Temperature Stability Flexible Substrate for Car Seat

Payment Type:T/T

Incoterm:FOB,CIF,EXW

Min. Order:50 Piece/Pieces

Transportation:Ocean,Air,Express

Port:Ningbo,Shanghai

Product Description
Product Attributes

Place Of OriginChina

Supply Ability & Additional Information

TransportationOcean,Air,Express

Place of OriginChina

CertificateISO9001:2015 / ISO14001:2015

HS Code8534009000

PortNingbo,Shanghai

Payment TypeT/T

IncotermFOB,CIF,EXW

Packaging & Delivery
Selling Units:
Piece/Pieces

High Temperature Stability Flexible Substrate for Car Seat


Precision etching of Semiconductor Chip Carrier refers to the process of selectively removing material from the chip carrier to create precise patterns or features. This can be done using various etching techniques such as wet etching or dry etching.
The semiconductor chip carrier is a package that houses the semiconductor chip and provides electrical connections to the external circuitry. It is typically made of a material such as ceramic or plastic, and it may have metal traces or pads for connecting the chip to the outside world.

Welcome to view our website and find Others Etching Products you need, waiting for your inquiry.

1. High Temperature Stability: Semiconductor ceramic substrates exhibit excellent high-temperature stability, enabling them to maintain reliable performance in high-temperature operating environments, making them suitable for high-temperature applications.

2. Excellent Insulating Properties: Semiconductor ceramic substrates have superior insulating properties, effectively isolating currents to prevent leakage and interference, thereby enhancing device reliability and stability.

3. Low Thermal Expansion Coefficient: Semiconductor ceramic substrates possess a low thermal expansion coefficient, ensuring dimensional stability even with temperature fluctuations, reducing the impact of temperature changes on devices.

4. Good Thermal Conductivity: Semiconductor ceramic substrates feature good thermal conductivity, helping to efficiently dissipate the heat generated by devices, preventing overheating damage.

5. High Mechanical Strength: Semiconductor ceramic substrates have sufficient mechanical strength to withstand mechanical stress and vibrations during assembly and transportation, reducing the risk of device damage.

6. Flatness and Precise Dimensions: Semiconductor ceramic substrates maintain a flat surface and precise dimensions, ensuring good contact and connections between devices.

7. Corrosion Resistance: Semiconductor ceramic substrates exhibit excellent corrosion resistance, resisting damage from chemical substances, thereby increasing device lifespan.

8. Multilayer Structure: Some semiconductor ceramic substrates adopt a multilayer structure, achieving higher circuit density and functional integration, catering to the demand for high-density integrated circuits.

9. Customizability: Semiconductor ceramic substrates can be custom-designed according to customer requirements, meeting specific needs in various application fields and devices.

10. Environmentally Friendly: Semiconductor ceramic substrates are manufactured using environmentally friendly materials, complying with environmental regulations and contributing to green production and sustainable development.


Etching Flexible Substrate Png

Company Overview

SHAOXING HUALI ELECTRONICS CO., LTD. is the earliest precision machining manufacturer in China and is also a national high-tech etching enterprise specialized in producing metal etching products. Since its establishment in 1994, the company specializes in the production of integrated circuit lead frames and power semiconductor packaging ceramic substrates. The company excels in multiple processes such as metal etching, glass etching, precision stamping, electroplating, precision mold making, and precision injection molding, earning it a reputation as an industry leader. These exceptional manufacturing processes have not only made products applicable to various fields including display, communication, electronics, optics, machinery, automotive, medical, AI intelligence, and consumer electronics but have also gained significant market acclaim.

Currently, the company's primary product lineup includes VCM-SPRING camera modules for mobile phones, mobile phone accessories, automotive parts, metal filter screens, encoder gratings, precision masks, and various precision microelectronic components. These products showcase the company's exceptional capabilities in precision manufacturing and have earned widespread market recognition.


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