Payment Type:T/T
Incoterm:FOB
Min. Order:50 Piece/Pieces
Port:Port of Shanghai,Port of Ningbo
Packaging: Electrostatic Protection - Cutting and Sorting - Packaging Material Preparation - Lead Frame Positioning - Packaging Enclosure - Labels and Identification - Quality Inspection
Supply Ability: High production capacity, high flexibility, diversified product range, and timely delivery
Port: Port of Shanghai,Port of Ningbo
Payment Type: T/T
Incoterm: FOB
Semiconductor packaging carriers are widely used in the semiconductor industry, including the packaging processes of integrated circuits, microprocessors, memory chips, and sensors, among others. Our products provide high-quality packaging carrier solutions to ensure reliable protection and excellent performance of the chips during the packaging process.
Product Features:
1. High-Quality Materials: Our semiconductor packaging carriers are manufactured using high-quality materials, offering excellent heat resistance, corrosion resistance, and mechanical strength to ensure reliable chip protection.
2. Customized Design: We provide customized packaging carrier solutions, designing and manufacturing according to customer requirements to meet different packaging needs and specific chip requirements.
3. Excellent Electrical Connectivity: The optimized design of our packaging carriers ensures stable and reliable electrical connectivity, providing outstanding signal transmission and electrical performance.
4. Heat Dissipation Performance: Our products exhibit excellent heat dissipation performance, effectively conducting heat away from the chips and maintaining their normal operating temperature.
If you have further inquiries regarding our range of products and associated data, please do not hesitate to contact us.
SHAOXING HUALI ELECTRONICS CO., LTD. is the earliest precision machining manufacturer in China and is also a national high-tech etching enterprise specialized in producing metal etching products. Since its establishment in 1994, the company specializes in the production of integrated circuit lead frames and power semiconductor packaging ceramic substrates. The company excels in multiple processes such as metal etching, glass etching, precision stamping, electroplating, precision mold making, and precision injection molding, earning it a reputation as an industry leader. These exceptional manufacturing processes have not only made products applicable to various fields including display, communication, electronics, optics, machinery, automotive, medical, AI intelligence, and consumer electronics but have also gained significant market acclaim.
Currently, the company's primary product lineup includes VCM-SPRING camera modules for mobile phones, mobile phone accessories, automotive parts, metal filter screens, encoder gratings, precision masks, and various precision microelectronic components. These products showcase the company's exceptional capabilities in precision manufacturing and have earned widespread market recognition.
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