Payment Type:T/T
Incoterm:FOB,CIF,EXW
Min. Order:50 Piece/Pieces
Transportation:Ocean,Air,Express
Port:NINGBO,SHANGHAI
$0.2-10 /Piece/Pieces
Place Of Origin: China
Transportation: Ocean,Air,Express
Place of Origin: CHINA
Certificate: ISO9001:2015 / ISO14001:2015
Port: NINGBO,SHANGHAI
Payment Type: T/T
Incoterm: FOB,CIF,EXW
DBC Ceramic Substrates have excellent thermal conductivity, making the chip package very compact, thus greatly increasing the power density and improving the reliability of systems and devices. Also, a large number of high-voltage, high-power devices have high requirements for heat dissipation, and ceramic substrates have a better heat dissipation effect. Moreover, it has excellent electrical insulation performance, excellent soft brazability, high adhesion strength and a large current-carrying capacity. DCB substrate is widely used in many fields, including semi-conductor cooler, electronic heater, high-power power semi-conductor module, solid-state relay, automotive electronics, aerospace and military electronic element, solar panel element, and many other industry electronic fields.
We custom High Precision DBC Substrate with drawings provided by customers. The raw material we use for Etched DBC Substrate is Ceramic-based double-sided copper clad laminate. We are equipped with professional metal etching equipment and exposure development equipment. Our etching process can achieve Double-Sided Etching of different graphics with 0.3 mm - 0.8mm thickness of copper clad laminate. Also, we can guarantee that our Double-Sided Copper Clad Laminate Substrate is neatly arranged, straight surface line, and have no burr, high product accuracy.
Below are the specific parameters of this product, please check more Semiconductor Chip Carrier in our website for more ideas.
| Material | Ceramic-based Double-sided Copper Clad Laminate |
| Thickness of Copper Clad Laminate | 0.3 mm - 0.8mm |
| Manufacturing Capacity Minimum Spacing | 0.5 mm - 1.2mm |
| Manufacturing Capacity Side Corrosion | 0 mm - 0.3mm |
|
DCB Performance Advantages | Good mechanical strength Good thermal conductivity Coefficient of thermal expansion close to silicon Good thermal stability Good insulation/dielectric strength Possibility to etch various kind of pattern like PCB substrate |
DBC Substrate PIC
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