Payment Type:T/T
Incoterm:FOB,CIF,EXW
Min. Order:50 Piece/Pieces
Transportation:Ocean,Air,Express
Port:NINGBO,SHANGHAI
$0.2-10 /Piece/Pieces
Place Of Origin: China
Transportation: Ocean,Air,Express
Place of Origin: CHINA
Certificate: ISO9001:2015 / ISO14001:2015
Port: NINGBO,SHANGHAI
Payment Type: T/T
Incoterm: FOB,CIF,EXW
Chemical Etching Thermal Conductivity DBC Ceramic Substrates
DBC Ceramic Substrate can be applied in various kinds of packaging of electronic module with possibility to etch various kinds of pattern on copper surface. At high temperatures, a copper foil substrate is bonded directly to the surface (single or double sided) of an AI203 OR AIN ceramic substrate. It is a green product without pollution and public harm, which also has a wide range of operating temperature. This substrate has many superiorities, for example, it is highly resistant to vibration and wear, ensuring its long service life. Also, A large number of high-voltage, high-power devices have high requirements for heat dissipation, and ceramic substrates have a better heat dissipation effect. Moreover, it has excellent electrical insulation performance, excellent soft brazability, high adhesion strength and a large current-carrying capacity. It is widely used in many fields, including electronic heater, automotive electronics, aerospace and military electronic element, solar panel element, high-power power semi-conductor module, solid-state relay and many other industry electronic fields.
We custom High Precision DBC Substrate with drawings provided by customers. The raw material we use for Etched DBC Substrate is Ceramic-based double-sided copper clad laminate. We are equipped with professional metal etching equipment and exposure development equipment. Our etching process can achieve Double-Sided Etching of different graphics with 0.3 mm - 0.8mm thickness of copper clad laminate. Also, we can guarantee that our Double-Sided Copper Clad Laminate Substrate is neatly arranged, straight surface line, and have no burr, high product accuracy.
Below are the specific parameters of this product, please check more Semiconductor Chip Carrier in our website for more ideas.
| Material | Ceramic-based Double-sided Copper Clad Laminate |
| Thickness of Copper Clad Laminate | 0.3 mm - 0.8mm |
| Manufacturing Capacity Minimum Spacing | 0.5 mm - 1.2mm |
| Manufacturing Capacity Side Corrosion | 0 mm - 0.3mm |
|
DCB Performance Advantages | Good mechanical strength Good thermal conductivity Coefficient of thermal expansion close to silicon Good thermal stability Good insulation/dielectric strength Possibility to etch various kind of pattern like PCB substrate |
DBC Substrate PIC
SHAOXING HUALI ELECTRONICS CO., LTD. is the earliest precision machining manufacturer in China and is also a national high-tech etching enterprise specialized in producing metal etching products. Since its establishment in 1994, the company specializes in the production of integrated circuit lead frames and power semiconductor packaging ceramic substrates. The company excels in multiple processes such as metal etching, glass etching, precision stamping, electroplating, precision mold making, and precision injection molding, earning it a reputation as an industry leader. These exceptional manufacturing processes have not only made products applicable to various fields including display, communication, electronics, optics, machinery, automotive, medical, AI intelligence, and consumer electronics but have also gained significant market acclaim.
Currently, the company's primary product lineup includes VCM-SPRING camera modules for mobile phones, mobile phone accessories, automotive parts, metal filter screens, encoder gratings, precision masks, and various precision microelectronic components. These products showcase the company's exceptional capabilities in precision manufacturing and have earned widespread market recognition.
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