Ms. Gracie Ge

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Ms. Gracie Ge

What can I do for you?

SHAOXING HUALI ELECTRONICS CO., LTD.
Home> Products> Semiconductor Chip Carrier> DBC Substrate> High Thermal Conductivity DBC Ceramic Substrate
High Thermal Conductivity DBC Ceramic Substrate
High Thermal Conductivity DBC Ceramic Substrate
High Thermal Conductivity DBC Ceramic Substrate

High Thermal Conductivity DBC Ceramic Substrate

Payment Type:T/T

Incoterm:CIF,FOB,EXW

Min. Order:50 Piece/Pieces

Transportation:Ocean,Air,Express

Port:NINGBO,SHANGHAI

Product Description
Product Attributes

Place Of OriginChina

Supply Ability & Additional Information

TransportationOcean,Air,Express

Place of OriginChina

CertificateISO9001:2015 / ISO14001:2015

HS Code8443999090

PortNINGBO,SHANGHAI

Payment TypeT/T

IncotermCIF,FOB,EXW

Packaging & Delivery
Selling Units:
Piece/Pieces
Ceramic-based Double-sided Copper Clad Laminate DBC Substrate


DBC Substrate is mainly used in the fields of rail transit, smart grid, new energy vehicles, industrial frequency conversion, household appliances, military power electronics, wind and photovoltaic power generation. The material we use in DBC Substrate is Ceramic-based double-sided copper clad laminate, Double-Sided Etching of different graphics, the thickness of copper clad laminate is 0.3 mm-0.8mm. We use fine metal etching process, and we can guarantee that our etched and machined DBC Substrate is alignment, neatly arranged, straight surface line, and have no burr, high product accuracy.
Below is the specific parameters of this product, Pls check more eliminators in our website for more ideas.

Thickness of Copper Clad Laminate
0.3 mm-0.8mm
Minimum Spacing
0.5 mm-1.2mm
Side Corrosion
0 mm-0.3mm




Dbc Substrate 1 Jpg

Company Overview

SHAOXING HUALI ELECTRONICS CO., LTD. is the earliest precision machining manufacturer in China and is also a national high-tech etching enterprise specialized in producing metal etching products. Since its establishment in 1994, the company specializes in the production of integrated circuit lead frames and power semiconductor packaging ceramic substrates. The company excels in multiple processes such as metal etching, glass etching, precision stamping, electroplating, precision mold making, and precision injection molding, earning it a reputation as an industry leader. These exceptional manufacturing processes have not only made products applicable to various fields including display, communication, electronics, optics, machinery, automotive, medical, AI intelligence, and consumer electronics but have also gained significant market acclaim.

Currently, the company's primary product lineup includes VCM-SPRING camera modules for mobile phones, mobile phone accessories, automotive parts, metal filter screens, encoder gratings, precision masks, and various precision microelectronic components. These products showcase the company's exceptional capabilities in precision manufacturing and have earned widespread market recognition.


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