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SHAOXING HUALI ELECTRONICS CO., LTD.
Home> News> DECADES OF EXPERIENCE IN FINE METAL ETCHING PROCESSING OF IC LEAD FRAME
August 22, 2022

DECADES OF EXPERIENCE IN FINE METAL ETCHING PROCESSING OF IC LEAD FRAME

Lead frame is a metal structure used as a carrier for integrated circuit chips. Lead frame is a key structural component to realize the electrical connection between the chip's internal circuit leads and the outer leads with the help of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. The development of lead frame industry is closely related to the development trend of semiconductor industry. Globally, the lead frame production capacity is mainly focus on China, the United States, Japan, Korea, Europe and other countries. In recent years, with the advancement of global industrial transfer, China`s semiconductor packaging and testing industry is developing faster, providing a broad demand market for the development of China`s lead frame industry. Coupled with a complete domestic industrial base, China is gradually becoming the world`s largest lead frame producer. In 2020, China's lead frame production will be over 40% of the total global lead frame production.

SHAOXING HUALI ELECTRONIC is a company with 28 years of etching experience in manufacturing IC Lead Frames. IC Lead Frame mainly used in 5G communication, artificial intelligence, smart cars, smart home, LED and more field. Our company mainly used the C192 and C194 material, C192 which have better conductivity. Our precise metal etching process can guarantee that our products have uniform arrangement, straight etching line and half etching surface is smooth and delicate.

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