Korea Develops FLEXIBLE SUBSTRATE that Can Be Embedded with Micro-components

August 19, 2022

According to a report recently organized by the Physicists Organization Network, a joint research group of Korea’s Gwangju Institute of Science and Technology, Seoul National University and Rice University has created a flexible test substrate embedded with single-molecule thick electronic components that can withstand the destruction of other electronic devices. distortion. The relevant research results were published in Nature Nanotechnology.

Many researchers are trying to develop a new form of consumer products, such as flexible mobile phones, smart device displays that can be shaped into a backpack or embedded round furniture. However, the problem is that when the substrate is bent, there is a tension between the transistor or other electronic component attached to it and the substrate, resulting in cracking or tearing, which eventually leads to destruction of the device.

After various tests, the research team chose polyimide as the substrate because of its flexible characteristics. More importantly, it does not crack when exposed to high temperatures, and can still generate heat when bent or twisted. . And when it is bent many times in a row, the state remains unchanged. So, the researchers used two terminals running similar diodes to create a single-molecule thick device on a Flexible Substrate and self-assembled using alkyl molecules.

In the test, the researchers created 512 such devices, each of which was a square with a size of only 3 cm, and then began performing various special bending exercises on them. These devices were bent into cylinders and toothpick holders, passed several motion-level twists, and were even bent into spirals, some with rapid bending of more than 1,000 consecutive times. Researchers do this by looking to see if each device can still be connected to a DC power supply through its terminals and have the ability to conduct electricity. The results show that the device's charge transfer characteristics remain stable under severe bending and over 1000 repeated repetitive bendings, and can also be configured to withstand various bends, including twisted pair and helical structures, and the performance is still reliable.

The next step will be to place three prongs, such as transistors, on the device to test if they can withstand the same degree of "torture." If successful, the researchers could fold the device made of this material, such as a cell phone, and place it in the back pocket of the trousers without worrying about being pressured when sitting down. (Hua Ling)

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