Payment Type:L/C,T/T
Incoterm:FOB,CIF,EXW
Min. Order:200 Piece/Pieces
Transportation:Ocean,Air,Express
Port:NINGBO,SHANGHAI
$0.01-10 /Piece/Pieces
Place Of Origin: China
Transportation: Ocean,Air,Express
Place of Origin: China
Certificate: ISO9001:2015 / ISO14001:2015
HS Code: 8542900000
Port: NINGBO,SHANGHAI
Payment Type: L/C,T/T
Incoterm: FOB,CIF,EXW
Competitive Price Uniform Frame Smooth and Delicate Pin
As the chip carrier for integrated circuits, lead frames are required in the vast majority of semiconductor blocks and are an important basic material in the electronic information industry. The Integrated Circuits Lead Frame maximizes chip performance, such as the heat-diffusing function, and enables it to be operated for long periods of time.
High Precision Etching IC Lead Frame is widely used in emerging products such as artificial intelligence, Internet of Things, smart manufacturing and new energy vehicles. The raw material use for IC Lead Frame are C192 or C194 Copper, which the material C192 has better conductivity. The production of smooth IC lead frames by metal etching process can achieve higher precision, for example, we can produce multi-pin (more than 100 pins) products of Multi-pin IC Lead Frame, and can also produce ultra-thin products, such as etched 0.125mm Thickness IC Lead Frame. Moreover, we can guarantee that our Copper IC Lead Frame or half etching lead frame have uniform arrangement, straight etching line and smooth and delicate finishes.
Below are the specific parameters of this product, please check more IC LEAD FRAME in our website for more ideas.
Application: IC Lead Frame, IC Chip Carrier
Product features: lead frame arrangement is uniform.
etching line is straight.
half etching surface is smooth and delicate, high precision.
Material: C192/C194 copper, thickness: 0.125mm- 0.25mm
Manufacturing capacity: minimum diameter :0.05mm Minimum distance :0.18 mm-0.3mm accuracy :±0.02 mm-±0.04 mm
SHAOXING HUALI ELECTRONICS CO., LTD. is the earliest precision machining manufacturer in China and is also a national high-tech etching enterprise specialized in producing metal etching products. Since its establishment in 1994, the company specializes in the production of integrated circuit lead frames and power semiconductor packaging ceramic substrates. The company excels in multiple processes such as metal etching, glass etching, precision stamping, electroplating, precision mold making, and precision injection molding, earning it a reputation as an industry leader. These exceptional manufacturing processes have not only made products applicable to various fields including display, communication, electronics, optics, machinery, automotive, medical, AI intelligence, and consumer electronics but have also gained significant market acclaim.
Currently, the company's primary product lineup includes VCM-SPRING camera modules for mobile phones, mobile phone accessories, automotive parts, metal filter screens, encoder gratings, precision masks, and various precision microelectronic components. These products showcase the company's exceptional capabilities in precision manufacturing and have earned widespread market recognition.
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